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Ono Seiko Co., Ltd. Repair Top Process Comprehensive Catalog

Ono Seiko Co., Ltd. Repair Top Process Comprehensive Catalog

Mainly a repair method for machine parts of production equipment through partial plating called "Repair Top Process."

The Repair Top Process is a repair method primarily involving partial plating of mechanical parts of production equipment. The principle is almost the same as plating, but it can be performed on-site without using a plating bath and without disassembling the mechanical parts. The "Repair Top Process Comprehensive Catalog" includes numerous sections such as "What is the Repair Top Process?", "Repair of Bearing Wear on Motor Shafts", "Repair of Production Equipment Parts in Rubber Manufacturing Plants", and "Examples of Repair Top Process Applications". [Contents] - What is the Repair Top Process? - Repair of Bearing Wear on Motor Shafts - Repair of Production Equipment Parts in Rubber Manufacturing Plants - Examples of Repair Top Process Applications - Examples of Repair Work For more details, please contact us or download the catalog.

  • Repair Agent
  • Processing Contract

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Electroless copper plating on liquid crystal polymer (LCP): Top LECS process

Electroless copper plating on liquid crystal polymer (LCP): Top LECS process

Plating treatment for LCP film with excellent high-frequency characteristics and dielectric properties! Development of a process that combines surface modification ensuring high adhesion and electroless plating.

Since 2020, following 4G, 5G mobile communication services have also started in Japan. 5G not only enables ultra-high-speed communication but also features ultra-low latency that allows for smooth operation of robots and other devices even in remote locations, as well as the ability to connect multiple smartphones and computers simultaneously. Currently, high-frequency compatible substrates using low-dielectric materials such as LCP and fluoropolymer resins are attracting attention as suitable materials for high-speed transmission. In particular, liquid crystal polymer (LCP) has excellent electrical properties in the high-frequency range, low moisture absorption, and superior dimensional stability, leading to its increasing adoption for 5G and millimeter-wave applications. Our company has developed a process that combines surface modification and plating to ensure high adhesion for LCP, which is said to be difficult to achieve with copper plating.

  • Chemicals

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Plating on Polyimide (PI) Film: Top SAPINA Process

Plating on Polyimide (PI) Film: Top SAPINA Process

Plating process for polyimide (PI) film for flexible printed circuit boards (FPC)! Ideal for fine circuit formation and via hole methods!

The advancement and miniaturization of electronic devices have led to a demand for further speed and density in printed circuit boards. Particularly, polyimide is widely used as a material for flexible printed circuits (FPC) due to its excellent heat resistance and dielectric properties. However, traditional methods have had limitations in the miniaturization of wiring. Therefore, Okuno Pharmaceutical Industry has developed an optimal process for fine wiring formation. ◆ Nickel seed layer formation process on polyimide (PI) film ◆ ~ Top SAPINA Process ~ What's amazing about it! - The entire process is achieved using a wet method. - Unlike dry methods (such as vapor deposition and sputtering), it does not require large and expensive equipment. - It realizes cost reduction. - Both sides can be processed at once. - High peel strength. - Ensures high adhesion. - Enables fine nickel/gold plating.

  • others

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Plating process for CFRP: Top TFAC process

Plating process for CFRP: Top TFAC process

A new plating process for the trending material CFRP! Imparts wear resistance, high gloss, and light resistance to CFRP! Ideal for lightweight yet strong CFRP!

The specific gravity of CFRP is said to be about one-fourth that of iron. With its lightweight, high strength, and excellent rigidity, CFRP is used as a structural material in aircraft and other applications due to its high design flexibility. Okuno Pharmaceutical Industry has developed an optimal plating process for the new material CFRP. ~Plating Process for CFRP: Top TFAC Process~ Here’s what’s amazing! - Improved wear resistance - Achieving metallic luster - Enhanced light resistance - Providing conductivity This process is compatible with the currently most widely used epoxy resin systems. CFRP made from polyamide (nylon) can also be plated. Our specialized sales staff will propose tailor-made processes and chemicals according to your needs. We can also introduce you to contractors, so please feel free to contact us.

  • Chemicals
  • plastic
  • Engineering Plastics

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